It might not have the aesthetic, lust-provoking appeal of a shiny new smartphone, but InterDigital’s new range of SlimChip mobile broadband processors could be more important – and certainly have more impact – than anything from the handset manufacturers’ stables.  Supporting theoretical speeds up to 10Mbps downlink and 5.7Mbps uplink (and real-world 7.2Mbps and 1.5Mbps in reference tests), the design separates the wireless modem from the applications processor handling OS and peripheral functions; InterDigital believe this offers maximum cost-effective customisation to OEM manufacturers.

One such OEM could include Apple, who signed a $56m deal with InterDigital last September in a move that many saw as confirmation that the chip company would be providing the 3G modems for next-gen iPhone models.

The contract involved InterDigital providing 2G and 3G technology – and beyond – to Apple for a seven year period, including bandwidth allocation, roaming, and power efficiency.

“InterDigital’s ability to deliver its SlimChip ICs, licensed IP and complete reference designs is significant given the transition at the OEM and even ODM level from single-vendor to multi-vendor strategies.  Market conditions are also favorable for expanded connectivity in numerous device categories. Beyond the performance specifications of the SlimChip products, which are considerable, InterDigital’s flexibility in terms of technology delivery format is a strong match to the evolving manufacturing landscape” John Jackson, Vice President of Enabling Technologies, Yankee Group

InterDigital’s chips are based on HSDPA and HSUPA technologies.